Application Note AN-1061 Bare Die: Die Attach and Wire Bonding Guidance for setting up assembly processes
نویسنده
چکیده
Page Introduction ..........................................................................................1 Storage and Handling ..........................................................................2 Note on ESD ........................................................................................2 Solders and Eutectics ..........................................................................3 Solder Die Attach .................................................................................4 Epoxy Die Attach..................................................................................4 Die Attach Inspection ...........................................................................5 Gold Wire Bonding...............................................................................7 Aluminum Wire Bonding.......................................................................8 Set-Up for Aluminum Wire Bonding .....................................................9 Interpreting Pull Test Results ..............................................................10 References...........................................................................................12
منابع مشابه
High Temperature Electronics Packaging
Materials and processes are being developed for packaging of low and medium power, high temperature electronics (up to 500). Ceramic (Al2O3 and AlN) hermetic packages are being used. Die attach techniques based on patterned Au bumps, Au-Si and off-eutectic Au-Sn have been demonstrated. Au thermosonic wire bonding provides a monometallic interconnect system between the die and the package pads. ...
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